CVE-2021-35090

CRITICAL

9.3

Description

Possible hypervisor memory corruption due to TOC TOU race condition when updating address mappings in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile

Details CVE

Score CVSS v3.19.3

SeveriteCRITICAL

Vecteur CVSSCVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:C/C:H/I:H/A:H

Vecteur d'attaqueLOCAL

ComplexiteLOW

Privileges requisNONE

Interaction utilisateurNONE

Publie6/14/2022

Derniere modification11/21/2024

Sourcenvd

Observations honeypot0

Produits affectes

qualcomm:aqt1000qualcomm:aqt1000_firmwarequalcomm:qca6390qualcomm:qca6390_firmwarequalcomm:qca6391qualcomm:qca6391_firmwarequalcomm:qca6420qualcomm:qca6420_firmwarequalcomm:qca6421qualcomm:qca6421_firmwarequalcomm:qca6426qualcomm:qca6426_firmwarequalcomm:qca6430qualcomm:qca6430_firmwarequalcomm:qca6431qualcomm:qca6431_firmwarequalcomm:qca6436qualcomm:qca6436_firmwarequalcomm:qcm6490qualcomm:qcm6490_firmwarequalcomm:qcs6490qualcomm:qcs6490_firmwarequalcomm:qrb5165qualcomm:qrb5165_firmwarequalcomm:qrb5165mqualcomm:qrb5165m_firmwarequalcomm:qrb5165nqualcomm:qrb5165n_firmwarequalcomm:qsm8350qualcomm:qsm8350_firmwarequalcomm:sa8540pqualcomm:sa8540p_firmwarequalcomm:sa9000pqualcomm:sa9000p_firmwarequalcomm:sd690_5gqualcomm:sd690_5g_firmwarequalcomm:sd750gqualcomm:sd750g_firmwarequalcomm:sd765qualcomm:sd765_firmwarequalcomm:sd765gqualcomm:sd765g_firmwarequalcomm:sd768gqualcomm:sd768g_firmwarequalcomm:sd778gqualcomm:sd778g_firmwarequalcomm:sd780gqualcomm:sd780g_firmwarequalcomm:sd865_5gqualcomm:sd865_5g_firmwarequalcomm:sd870qualcomm:sd870_firmwarequalcomm:sd888qualcomm:sd888_5gqualcomm:sd888_5g_firmwarequalcomm:sd888_firmwarequalcomm:sd_8cxqualcomm:sd_8cx_firmwarequalcomm:sd_8cx_gen2qualcomm:sd_8cx_gen2_firmwarequalcomm:sdx55mqualcomm:sdx55m_firmwarequalcomm:sdxr2_5gqualcomm:sdxr2_5g_firmwarequalcomm:sm7250pqualcomm:sm7250p_firmwarequalcomm:sm7315qualcomm:sm7315_firmwarequalcomm:sm7325pqualcomm:sm7325p_firmwarequalcomm:wcd9340qualcomm:wcd9340_firmwarequalcomm:wcd9341qualcomm:wcd9341_firmwarequalcomm:wcd9370qualcomm:wcd9370_firmwarequalcomm:wcd9375qualcomm:wcd9375_firmwarequalcomm:wcd9380qualcomm:wcd9380_firmwarequalcomm:wcd9385qualcomm:wcd9385_firmwarequalcomm:wcn3988qualcomm:wcn3988_firmwarequalcomm:wcn3991qualcomm:wcn3991_firmwarequalcomm:wcn3998qualcomm:wcn3998_firmwarequalcomm:wcn6740qualcomm:wcn6740_firmwarequalcomm:wcn6750qualcomm:wcn6750_firmwarequalcomm:wcn6850qualcomm:wcn6850_firmwarequalcomm:wcn6851qualcomm:wcn6851_firmwarequalcomm:wcn6855qualcomm:wcn6855_firmwarequalcomm:wcn6856qualcomm:wcn6856_firmwarequalcomm:wcn7850qualcomm:wcn7850_firmwarequalcomm:wcn7851qualcomm:wcn7851_firmwarequalcomm:wsa8810qualcomm:wsa8810_firmwarequalcomm:wsa8815qualcomm:wsa8815_firmwarequalcomm:wsa8830qualcomm:wsa8830_firmwarequalcomm:wsa8835qualcomm:wsa8835_firmware

Faiblesses (CWE)

CWE-367

References

https://www.qualcomm.com/company/product-security/bulletins/may-2022-bulletin(product-security@qualcomm.com)

https://www.qualcomm.com/company/product-security/bulletins/may-2022-bulletin(af854a3a-2127-422b-91ae-364da2661108)

Correlations IOC

Aucune correlation enregistree

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