CVE-2019-2266

HIGH

7.8

Description

Possible double free issue in kernel while handling the camera sensor and its sub modules power sequence in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8053, IPQ4019, IPQ8064, MDM9206, MDM9207C, MDM9607, MSM8909, MSM8909W, Nicobar, QCA9980, QCS405, QCS605, SDM845, SDX24, SM7150, SM8150

Details CVE

Score CVSS v3.17.8

SeveriteHIGH

Vecteur CVSSCVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Vecteur d'attaqueLOCAL

ComplexiteLOW

Privileges requisLOW

Interaction utilisateurNONE

Publie11/21/2019

Derniere modification11/21/2024

Sourcenvd

Observations honeypot0

Produits affectes

qualcomm:apq8053qualcomm:apq8053_firmwarequalcomm:ipq4019qualcomm:ipq4019_firmwarequalcomm:ipq8064qualcomm:ipq8064_firmwarequalcomm:mdm9206qualcomm:mdm9206_firmwarequalcomm:mdm9207cqualcomm:mdm9207c_firmwarequalcomm:mdm9607qualcomm:mdm9607_firmwarequalcomm:msm8909qualcomm:msm8909_firmwarequalcomm:msm8909wqualcomm:msm8909w_firmwarequalcomm:nicobarqualcomm:nicobar_firmwarequalcomm:qca9980qualcomm:qca9980_firmwarequalcomm:qcs405qualcomm:qcs405_firmwarequalcomm:qcs605qualcomm:qcs605_firmwarequalcomm:sdm845qualcomm:sdm845_firmwarequalcomm:sdx24qualcomm:sdx24_firmwarequalcomm:sm7150qualcomm:sm7150_firmwarequalcomm:sm8150qualcomm:sm8150_firmware

Faiblesses (CWE)

CWE-415

References

https://www.qualcomm.com/company/product-security/bulletins/october-2019-bulletin(product-security@qualcomm.com)

https://www.qualcomm.com/company/product-security/bulletins/october-2019-bulletin(af854a3a-2127-422b-91ae-364da2661108)

Correlations IOC

Aucune correlation enregistree

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