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CVE-2019-2266
HIGH7.8
Beschreibung
Possible double free issue in kernel while handling the camera sensor and its sub modules power sequence in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8053, IPQ4019, IPQ8064, MDM9206, MDM9207C, MDM9607, MSM8909, MSM8909W, Nicobar, QCA9980, QCS405, QCS605, SDM845, SDX24, SM7150, SM8150
CVE Details
CVSS v3.1 Bewertung7.8
SchweregradHIGH
CVSS VektorCVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
AngriffsvektorLOCAL
KomplexitatLOW
Erforderliche PrivilegienLOW
BenutzerinteraktionNONE
Veroffentlicht11/21/2019
Zuletzt geandert11/21/2024
Quellenvd
Honeypot-Sichtungen0
Betroffene Produkte
qualcomm:apq8053qualcomm:apq8053_firmwarequalcomm:ipq4019qualcomm:ipq4019_firmwarequalcomm:ipq8064qualcomm:ipq8064_firmwarequalcomm:mdm9206qualcomm:mdm9206_firmwarequalcomm:mdm9207cqualcomm:mdm9207c_firmwarequalcomm:mdm9607qualcomm:mdm9607_firmwarequalcomm:msm8909qualcomm:msm8909_firmwarequalcomm:msm8909wqualcomm:msm8909w_firmwarequalcomm:nicobarqualcomm:nicobar_firmwarequalcomm:qca9980qualcomm:qca9980_firmwarequalcomm:qcs405qualcomm:qcs405_firmwarequalcomm:qcs605qualcomm:qcs605_firmwarequalcomm:sdm845qualcomm:sdm845_firmwarequalcomm:sdx24qualcomm:sdx24_firmwarequalcomm:sm7150qualcomm:sm7150_firmwarequalcomm:sm8150qualcomm:sm8150_firmware
Schwachen (CWE)
CWE-415
Referenzen
https://www.qualcomm.com/company/product-security/bulletins/october-2019-bulletin(product-security@qualcomm.com)
https://www.qualcomm.com/company/product-security/bulletins/october-2019-bulletin(af854a3a-2127-422b-91ae-364da2661108)
IOC Korrelationen
Keine Korrelationen erfasst
This product uses data from the NVD API but is not endorsed or certified by the NVD.