CVE-2019-2266

HIGH

7.8

Descripcion

Possible double free issue in kernel while handling the camera sensor and its sub modules power sequence in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8053, IPQ4019, IPQ8064, MDM9206, MDM9207C, MDM9607, MSM8909, MSM8909W, Nicobar, QCA9980, QCS405, QCS605, SDM845, SDX24, SM7150, SM8150

Detalles CVE

Puntuacion CVSS v3.17.8

SeveridadHIGH

Vector CVSSCVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Vector de ataqueLOCAL

ComplejidadLOW

Privilegios requeridosLOW

Interaccion usuarioNONE

Publicado11/21/2019

Ultima modificacion11/21/2024

Fuentenvd

Avistamientos honeypot0

Productos afectados

qualcomm:apq8053qualcomm:apq8053_firmwarequalcomm:ipq4019qualcomm:ipq4019_firmwarequalcomm:ipq8064qualcomm:ipq8064_firmwarequalcomm:mdm9206qualcomm:mdm9206_firmwarequalcomm:mdm9207cqualcomm:mdm9207c_firmwarequalcomm:mdm9607qualcomm:mdm9607_firmwarequalcomm:msm8909qualcomm:msm8909_firmwarequalcomm:msm8909wqualcomm:msm8909w_firmwarequalcomm:nicobarqualcomm:nicobar_firmwarequalcomm:qca9980qualcomm:qca9980_firmwarequalcomm:qcs405qualcomm:qcs405_firmwarequalcomm:qcs605qualcomm:qcs605_firmwarequalcomm:sdm845qualcomm:sdm845_firmwarequalcomm:sdx24qualcomm:sdx24_firmwarequalcomm:sm7150qualcomm:sm7150_firmwarequalcomm:sm8150qualcomm:sm8150_firmware

Debilidades (CWE)

CWE-415

Referencias

https://www.qualcomm.com/company/product-security/bulletins/october-2019-bulletin(product-security@qualcomm.com)

https://www.qualcomm.com/company/product-security/bulletins/october-2019-bulletin(af854a3a-2127-422b-91ae-364da2661108)

Correlaciones IOC

Sin correlaciones registradas

This product uses data from the NVD API but is not endorsed or certified by the NVD.